PWM amplifier chips

PWM amplifier chips requires an analysis of performance specifications. Output current is the maximum continuous current that can be delivered in the output. Input offset voltage is the amount of DC voltage that amplifiers produce even when 0 V is applied to the input. The supply voltage range includes minimum and maximum amounts. Internal power dissipation is the maximum amount of power that can be safely supported. Quiescent current is produced during normal operation. The power bandwidth or large-signal bandwidth describes an amplifier’s ability to provide a maximum output voltage swing with increasing frequency. The peak output swing is the output voltage at the frequency which represents the upper limit of the power bandwidth. A high switching frequency allows smaller output filters to be built into the amplifier enclosure. Typically, suppliers list the switching frequency for PWM amplifier chips as a maximum amount.

PWM amplifier chips are available in a variety of integrated circuit (IC) package types and with different numbers of pins. Basic IC package types include single in-line package (SIP), dual in-line package (DIP), discrete package (DPAK), small outline package (SOP), and quad flat package (QFP). Many packaging variants are available. For example, common SOP variants include shrink small outline package (SSOP) and thin shrink small outline L-leaded package (TSSOP). Small outline integrated circuit (SOIC) packaging is also available for PWM amplifier chips. TO-3 is a transistor outline (TO) package with three leads. TO-92, another transistor outline package, is often used for low power devices. By contrast, TO-220 is suitable for high power, medium current, and fast-switching power devices.